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| BAT48 Series Small signal Schottky diodes Main product characteristics IF VRRM C (typ) Tj (max) 350 mA 40 V 18 pF 150 C BAT48ZFILM (Single) SOD-123 Features and benefits Low leakage current losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode BAT48JFILM (Single) SOD-323 Configurations in top view Description The BAT48 series uses 40 V Schottky barrier diodes packaged in SOD-123 or SOD-323. This series is general purpose and features very low turn-on voltage and fast switching Table 1. Symbol VRRM IF IFSM Tstg Tj Repetitive peak reverse voltage Continuous forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Order codes Part Number BAT48ZFILM BAT48JFILM Marking Z48 48 Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified) Parameter Value 40 350 tp = 10 ms Sinusoidal 2 -65 to +150 150 Unit V mA A C C August 2006 Rev 1 1/8 www.st.com Characteristics BAT48 Series 1 Table 2. Symbol Rth(j-a) Characteristics Thermal parameters Parameter Junction to ambient(1) SOD-123 SOD-323 Value 500 C/W 550 Unit 1. Epoxy printed circuit board with recommended pad layout Table 3. Symbol VBR Static electrical characteristics Parameter Breakdown reverse voltage Test conditions Tj = 25 C Ir = 25 A VR = 1.5 V Tj = 25 C VR = 10 V VR = 20 V VR = 40 V VR = 1.5 V Tj = 60 C VR = 10 V VR = 20 V VR = 40 V IF = 0.1 mA IF = 1 mA Min. 40 1 2 5 25 A 10 15 25 50 0.25 0.3 0.4 V 0.5 0.75 0.9 Typ Max. Unit V IR(1) Reverse leakage current VF(2) Forward voltage drop Tj = 25 C IF = 10 mA IF = 50 mA IF = 200 mA IF = 500 mA 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % Table 4. Symbol C Dynamic characteristics Parameter Diode capacitance Test conditions VR = 0 V, F = 1 MHz VR = 1 V, F = 1 MHz Min. Typ 30 pF 18 Max. Unit 2/8 BAT48 Series Characteristics Figure 1. P(W) 0.30 Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) 0.40 Average forward current versus ambient temperature ( = 1) 0.25 = 0.05 = 0.1 = 0.2 = 0.5 0.35 0.30 0.20 =1 0.25 0.20 0.15 0.15 0.10 T 0.05 0.10 0.05 T IF(AV)(A) 0.00 0.00 0.05 0.10 0.15 0.20 0.25 =tp/T 0.30 0.35 tp 0.00 0.40 0 =tp/T 25 tp 50 Tamb(C) 75 100 125 150 Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature (typical values) IR(A) 1.E+04 IR(A) 1.E+04 VR=40V 1.E+03 Tj=125C 1.E+03 Tj=100C 1.E+02 Tj=75C 1.E+02 1.E+01 Tj=50C 1.E+01 1.E+00 Tj=25C 1.E+00 1.E-01 0 5 10 15 VR(V) 20 25 30 35 40 Tj(C) 1.E-01 0 25 50 75 100 125 Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values) C(pF) 35 30 25 20 1.E-02 15 10 5 F=1MHz VOSC=30mVRMS Tj=25C IFM(A) 1.E+00 1.E-01 Tj=125C Tj=25C 1.E-03 VR(V) 0 0 5 10 15 20 25 30 35 40 1.E-04 0.0 0.2 0.4 VFM(V) 0.6 0.8 1.0 3/8 Ordering information scheme BAT48 Series Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, eCU = 35 m) (SOD-323) Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board, epoxy FR4, eCU=35 m, SOD-323) Zth(j-a)/Rth(j-a) 1.00 600 Rth(j-a)(C/W) 550 SOD-323 Epoxy FR4 SCU = 2.25 mm2 eCU = 35 m 500 0.10 Single pulse 450 400 350 tp(s) 0.01 1.E-02 300 SCU(mm) 1.E+01 1.E+02 0 5 10 15 20 25 30 35 40 45 50 1.E-01 1.E+00 2 Ordering information scheme BAT48 Signal Schottky diodes VRRM = 40 V Configuration No letter = Single diode Package J = SOD-323 Z = SOD-123 Packing FILM = Tape and reel xx xx FILM 4/8 BAT48 Series Package information 3 Package information Epoxy meets UL94, V0 Table 5. SOD-123 dimensions Dimensions Ref. H A2 A1 b E Millimeters Min. Max. 1.45 0 0.85 0.1 1.35 0 Inches Min. Max. 0.057 0.004 0.053 A A1 D A A2 b 0.033 0.55 Typ. 0.15 Typ. 2.55 1.4 0.25 3.55 3.95 2.85 1.7 0.022 Typ. 0.039 Typ. 0.1 0.055 0.01 0.14 0.156 0.112 0.067 c c D E G G H Figure 9. SOD-123 footprint (dimensions in mm) 4.45 0.65 0.97 2.51 0.97 5/8 Package information Table 6. SOD-323 dimensions BAT48 Series Dimensions H b E A1 Ref. Millimeters Min. Max. 1.17 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41 0 Inches Min. Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016 A A1 D A b c 0.01 0.004 0.06 0.044 0.09 0.004 0.004 c Q1 D E H L L Q1 Figure 10. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 BAT48 Series Ordering information 4 Ordering information Part Number BAT48ZFILM BAT48JFILM Marking Z48 48 Package SOD-123 Single SOD-323 Single Weight 10 mg 5 mg Base qty 3000 3000 Delivery mode Tape and reel Tape and reel 5 Revision history Date 08-Aug-2006 Revision 1 Initial release. Description of Changes 7/8 BAT48 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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